Mutli-Material Additive Manufacturing
at ORAU/ORISE DoD Programs

Date Posted: 11/26/2018

Opportunity Description

Title of Research Opportunity: Process parameter optimization for mutli-material Additive Manufacturing of functional structures Additive Manufacturing (AM) is a group of technologies that build objects layer-upon-layer until the desired three dimensional object is completed. In this way, AM is considered a “printing” technique. This is the opposite of subtractive manufacturing (traditional machining process) that start with a large feedstock and subtract away material until the desired three dimensional object is completed. AM technologies exist that can “print” many types of martials (metals, ceramics, polymers, glass, food, concrete, etc.). HM is a mixture of any/all AM and subtractive technologies that allow for the fabrication of complex, multi-material, structures. There are many hurdles to overcome in order to optimize AM and HM processes. Consider the example of an electrically conductive material joined to a dielectric material to create a functional device, like an antenna. While the bonding (interface) of these materials contribute to the structural performance, their interaction (interphase) with one another contributes to the functional performance of the device. This is compounded as more materials and more functions are added to the system. This is further complicated by manufacturing these devices in three dimensions. HM of functional devices has been demonstrated for stretchable sensors [1], energy harvesting devices [2], antenna isolation [3], shape changing (“4D”) structures and other applications. While technical demonstrators are possible, it is well documented that gaps exist in the optimization of interfacial (intra and interlaminar) bonding within additively manufactured parts. This issue is amplified when interfaces of multiple materials are considered, and more so when considering the function of the individual materials. The selected Participant will perform manufacturing research associated with the development of printing three dimensional functional specimens using HM techniques. This research will be focused on process optimization and interface analysis related to the processing of functional devices. The Participant will fabricate and analyze test specimens consisting of single and multi-material depositions. Testing may include material (thermal and electrical properties) and mechanical characterization (strength, toughness and durability). With knowledge gained, the Participant will then analyze the interphase properties of fabricated specimens. The goal will be to tie material and process variables to specimen performance. The Participant should have an advanced degree, or be working toward an advanced degree in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Aerospace Engineering, Industrial Engineering, Materials Science, or similar technical area. The Participant should have a working knowledge of more than two types of AM processes. References: 1. S.-Z. Guo, K. Qiu, F. Meng, S. H. Park, M. C. McAlpine. '3D Printed Stretchable Tactile Sensors.' Adv. Mater. (2017). 2. H.-A. Chin, T. Liang, S. Xu, G. R. Poirier, N. Yao, S. Wagner, M. C. McAlpine. 'Wireless Biomechanical Power Harvesting via Flexible Magnetostrictive Ribbons.' Energy Environ. Sci. 7, 2243-2249 (2014). 3. 14.R. C. Rumpf, C. R. Garcia, H. H. Tsang, J. E. Padilla, M. D. Irwin, 'Electromagnetic Isolation of a Microstrip by Embedding in a Spatially Variant Anisotropic Metamaterial,' PIER, Vol. 142, pp. 243-260, 2013. Keywords: additive, hybrid, printed electronics, manufacturing Click here for more information

Opportunity Snapshot

About Us

Oak Ridge Associated Universities (ORAU) administers Science, Technology, Engineering and Mathematics (STEM) research participation programs for civilians such as:

The Oak Ridge Institute for Science and Education (ORISE) Program that allow senior scientists, faculty; high school, bachelor’s, masters’ and doctoral students, and recent graduates to enhance their science education experience in projects and activities at our Department of Defense (DOD) and other Government and Private Industry customers’ laboratories and research facilities worldwide.

The U.S. Army Research Laboratory (ARL) Research Associateship Program (RAP) allow Postdoctoral Fellows, Journeyman Fellows (undergraduate and graduates students and recent graduates), Senior Researchers, and Summer Faculty engage in research initiatives of their own choice, that are compatible with the interests of the government and will potentially contribute to the general effort of the ARL. Scientists and engineers at ARL help shape and execute the Army's program for meeting the challenge of developing technologies that will support Army forces in meeting future operational needs.

Research opportunities include, but are not limited to the following disciplines: Aerospace Engineering, Anthropology, Archeology, Biology, Biochemistry, Biological Engineering, Biomechanical Engineering, Biomedical Engineering, Chemical Engineering, Chemistry, Computer Science, Computer Engineering, Electrical Engineering, Environmental Health Risk Assessment, Environmental Science, Entomology, Epidemiology, Ergonomics, Geology, Health Education Mechanical Engineering, Materials Science, Mathematics, Nanotechnology, Photonics, Physics, Public Health Economics, Public Health Policy, and more.

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