Advanced Power Electronics Packaging and Thermal M
at ORAU Workforce Solutions

Date Posted: 1/9/2019

Opportunity Description

Title of Research Opportunity: Advanced Power Electronics Packaging and Thermal Management In this opportunity, the post doc will lead an effort in co-design and transient thermal mitigation for future power module designs. The co-design efforts include future module designs with integrated heat sinks and stacked power devices for significant size and weight reduction as compared to commercial power modules. The transient thermal mitigation includes the integration of metallic PCMs directly in contact with the heat dissipating surface for >50% reduction in chip temperature during pulsed applications. The post doc will be trained to perform laboratory research including fabrication and testing of an electronics system with an integrated cooling system. Fabrication will include research in a world-class cleanroom environment and electronics packaging laboratory. Testing will include design and implementation of an electronics test-bed. The candidate should be a motivated, quick learner who pays attention to detail and can think critically. Keywords: codesign, transient thermal mitigation, PCM, power electronics Click here for more information

Opportunity Snapshot

About Us

Oak Ridge Associated Universities (ORAU) administers Science, Technology, Engineering and Mathematics (STEM) research participation programs for civilians such as:

The U.S. Army Research Laboratory (ARL) Research Associateship Program (RAP) allow Postdoctoral Fellows, Journeyman Fellows (undergraduate and graduates students and recent graduates), Senior Researchers, and Summer Faculty engage in research initiatives of their own choice, that are compatible with the interests of the government and will potentially contribute to the general effort of the ARL. Scientists and engineers at ARL help shape and execute the Army's program for meeting the challenge of developing technologies that will support Army forces in meeting future operational needs.

Research opportunities include, but are not limited to the following disciplines: Aerospace Engineering, Anthropology, Archeology, Biology, Biochemistry, Biological Engineering, Biomechanical Engineering, Biomedical Engineering, Chemical Engineering, Chemistry, Computer Science, Computer Engineering, Electrical Engineering, Environmental Health Risk Assessment, Environmental Science, Entomology, Epidemiology, Ergonomics, Geology, Health Education Mechanical Engineering, Materials Science, Mathematics, Nanotechnology, Photonics, Physics, Public Health Economics, Public Health Policy, and more.

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